series hp3 technical metal case, case-mounted semiconductors hp3 series for single to-3 or stud mount description of curves a. b. c. d. e. n.c. horiz. device only mounted to g-10. n.c horiz. & vert. with dissipator. 200 fpm w/diss. 500 fpm w/diss. 1000 fpm w/diss. ? thermal resistance case to sink is 0.1-0.3 c/w w/joint compound. ? derate 1.0 c/watt for unplated part in natural convection only. ordering information cts ierc part no. unplated comm'l. black anodize mil. black anodize semiconductor accommodated hole patt. ref. no. max. weight (grams) hp3-000-u hp3-t03-u hp3-t03-33u hp3-000-cb hp3-t03-cb hp3-t03-33cb hp3-000-b hp3-t03-b hp3-t03-33b undrilled t0-3 t0-3 ic -- 16 17 55.0 55.0 55.0
hp3-t03-44u hp3-436-u hp3-t015-u hp3-t06-u hp3-420-u hp3-t03-44cb hp3-436-cb hp3-t015-cb hp3-t06-cb HP3-420-CB hp3-t03-44b hp3-436-b hp3-t015-b hp3-t06-b hp3-420-b t0-3 panel mount t0-3 (4 pin) t0-15, d0-5 t0-6, t0-36 universal 31 18 23 19 27 55.0 55.0 55.0 55.0 55.0 hp3 for dual to-3 outline description of curves a. b. c. d. e. n.c. horiz. device only mounted to g-10. n.c horiz. & vert. with dissipator. 200 fpm w/diss. 500 fpm w/diss. 1000 fpm w/diss. ? thermal resistance case to sink is 0.1-0.3 c/w w/joint compound. ? derate 2.0 c/watt for unplated part in natural convection only. ordering information cts ierc part no. unplated comm'l. black anodize mil. black anodize semiconductor accommodated hole patt. ref. no. max. weight (grams) hp3-t03-4u hp3-437-u hp3-t03-4cb hp3-437-cb hp3-t03-4b hp3-437-b two to-3s two to-3s (4 pin) 6 12 55.0 55.0
hp3 for three to-3 outline description of curves a. b. c. d. e. n.c. horiz. device only mounted to g-10. n.c horiz. & vert. with dissipator. 200 fpm w/diss. 500 fpm w/diss. 1000 fpm w/diss. ? thermal resistance case to sink is 0.1-0.3 c/w w/joint compound. ? derate 3.0 c/watt for unplated part in natural convection only. ordering information cts ierc part no. unplated comm'l. black anodize mil. black anodize semiconductor accommodated hole patt. ref. no. max. weight (grams) hp3-t03-8u hp3-t03-8cb hp3-t03-8b three to-3s 13 55.0
hole patterns 6. hole pattern no. 124 accomodates two to-3s. available in hp3 series heat dissipators only. 12. hole pattern no. 437 accommodates two to-3s (4-pin). available in hp3 series heat dissipators only. 13. hole pattern no. 186 accommodates three to-3s. available in hp3 series heat dissipators only. 16. hole pattern no. 1 accommodates t0-3s. available in up, up1, up2, hp1, and hp3 series heat dissipators.
17. hole pattern no. 202 accommodates t0-3 ics. available in up, up1, up2, hp1, and hp3 series heat dissipators. 18. hole pattern no. 436 accomodates t0-3s (4-pin). available in up, up1, up2, hp1, and hp3 series heat dissipators. 19. hole pattern no. 2 accommodates t0-6s or t0-36s. available in up, up1, up2, hp1, and hp3 series heat dissipators. 23. hole pattern no. 3 accommodates t0-15s, d0-5s and other 1/4" stud mount devices. available in up, up1, up2, hp1, and hp3 series heat dissipators. 27. hole pattern no. 420 (universal) accommodates t0-3s, t0- 66s, t0-126s, t0-127s, or t0-220s. available in up, up1, up2, hp1, and hp3 series heat dissipators. 31. hole pattern no. 213 accommodates one to-3 (panel mounted). available in hp1 and hp3 series heat dissipators only.
cts ierc, heat sinks and thermal management solutions 413 north moss street, burbank, california 91502 tel: (818) 842-7277 fax: (818) 848-8872 rev. 04-13-04
|
